1.Base for monocrystalline silicon furnace, supporting integrated intelligent crystal equipment manufacturing
This semiconductor monocrystalline silicon furnace base has very high precision requirements. Welding needs to be magnetically particle inspected, and after welding requires standard annealing in a high-temperature CNC electric furnace. Finally, machining is done on a Mitsubishi Heavy Industries MVR45 gantry boring and milling machine.
The base plays a critical role in the monocrystalline silicon pulling process for semiconductor wafer production. We implement comprehensive quality control measures including using strict welding procedures, nondestructive examination, heat treatment, and precision machining on advanced equipment to ensure the base meets the high standards needed for this application. Our expertise in fabricating furnace bases contributes to the overall performance and yields of the crystal growth equipment.
2.Main body components for solar cell laser cutting machine
Laser cutting has minimal heat effect and high cutting accuracy, so laser cutting machines are widely used in the solar photovoltaic industry for cutting solar cells and silicon wafers.
The main frame for this laser cutting machine has extremely high precision requirements. We used synchronized machining with Italian Pama planer-type machining centers and Wuchang floor boring machines, followed by 3-coordinate inspection to ensure completely accurate precision of the product.
The laser cutting machine frame provides the foundation and structural support for all the other components like the laser generator, cooling system, control system, etc. Our machining expertise and quality control ensures the dimensional stability and flatness of the frame meets the tight tolerances needed for smooth and precise operation of the cutting head. High precision in the frame helps the machine produce solar cells with minimal kerf loss and high utilization of the silicon material. We are proud to supply machined frames that enable solar companies to cut cells faster and more accurately.
